Cimatron’s “Mission Critical” Software on Show in Italy

Givat Shmuel, Israel - January 28, 2014

Cimatron Limited (NASDAQ: CIMT) today announced that its CimatronE and GibbsCAM software will be demonstrated at the Fornitore Offresi trade show, Lecco, Italy, from February 6-7, 2014.

“Italian industry is a world leader in the design of high quality goods,” said Mr Gianluca Renzi, Managing Director of Microsystem, Cimatron’s Italian subsidiary. “However, local manufacturers are under increasing pressure to find efficiencies in the face of overseas competition, and the challenge remains to find those efficiencies without sacrificing quality. Our signature software solutions, CimatronE and GibbsCAM, continue to meet manufacturers’ needs in this respect, offering mission-critical capabilities that streamline mold, die and discrete part design, and provide NC programming efficiencies and optimized machining.”

“Manufacturers also receive the highest level of support and training for which Microsystem has been renowned for over 30 years, ensuring that our customers’ operations are always up and running.”

Among the benefits of CimatronE to be demonstrated at Fornitore Offresi will be its built-in CAD/CAM integration for mold and die makers, providing full associativity across the manufacturing process, from quoting through design and delivery. This ensures immediate and hassle-free communication between designers, programmers and the shop-floor, and the error-free transmission of data. It also provides significant time savings, facilitating concurrent engineering and the ability to begin machining mold and die components early on in the design process.

As a full-featured CAM system, GibbsCAM provides powerful capabilities while supporting ease of use. One of the software’s outstanding benefits to be emphasized at Fornitore Offresi will be its huge library of proven post processors, able to power any Multi-Task Machine (MTM) available on the market today.

The CimatronE and GibbsCAM display at Fornitore Offresi will be held at the booth of Microsystem, Hall B, booth 314.

Publish Date: 
Tuesday, January 28, 2014